Microstructure and electric properties of Sip/Al composites for
 electronic packaging applications

XIUZi-yang(修子扬),WUGao-hui(武高辉),ZHANGQiang(张 强),SONGMei-hui(宋美慧),TIANShou-fu(田首夫)

Transactions of Nonferrous Metals Society of China ›› 2007, Vol. 17 ›› Issue (Special 1) : 1034-1038.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2007, Vol. 17 ›› Issue (Special 1) : 1034-1038.
Special Functional Materials

Microstructure and electric properties of Sip/Al composites for
 electronic packaging applications

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2007, 17(Special 1): 1034-1038

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